IIT Guwahati and Tata Electronics plan chip packaging centre and courses

The Indian Institute of Technology Guwahati and Tata Electronics signed a memorandum of understanding on October 30, 2026, at the IIT Guwahati campus to set up a Centre of Excellence in semiconductor assembly, testing, marking and packaging, known in the industry as ATMP. The agreement also covers new diploma and BTech programmes in semiconductor packaging. No funding figure was disclosed.

Under the arrangement, IIT Guwahati will lead the design and delivery of the education programmes, while course content, learning materials and specialised training modules will be developed jointly with Tata Electronics. The partners plan to identify engineering colleges, universities and polytechnics, mainly in Assam, to take part, and to offer hands-on training to students from those institutions. The plan also includes training for faculty at participating colleges, training opportunities for students at Tata Electronics, and joint research for undergraduate and postgraduate students in packaging, assembly, testing and related technologies.

The memorandum was signed for the institute by its dean of research and development and for the company by its chief human resources officer, with the IIT Guwahati director present. Programme durations, intake numbers, start dates and the number of partner institutions were not stated in the report of the signing.